Meet Ryan Parrott, Packaging Engineer at Intel. His job is to design and test the custom packaging solutions used to ship silicon wafers all over the world. In order to learn which solutions work, Ryan has got to push expensive wafers potentially containing thousands of processors to their breaking points.
The packaging used to ship wafers is called a Front-Opening Shipping Box, or FOSB. Each of these specially-designed boxes contain 25 glass-like, silicon wafers totaling $250,000 to multi-million US dollars per box depending on product. Each wafer is incredibly fragile, and it’s Ryan’s job to insure that each FOSB makes it to its destination with all wafers intact.
Check out Ryan’s story, and stay tuned for more stories “Inside the Fab” at Intel. Subscribe now to Intel on YouTube:
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Intentionally Shattering Wafers | Inside the Fab | Intel
